@I(D) (A) (Test Condition): | 2.0 |
@Temp (øC) (Test Condition): | 25 |
g(fs) Min. (S) Trans. conduct.: | 3.7Â |
@I(D) (A) (Test Condition): | 3.0 |
@Temp (øC): | 70 |
Mounting Style: | S |
I(D) Max. (A): | 3.0 |
Package Style: | SO |
I(DSS) Max. (A): | 2u |
r(DS)on Max. (Ohms): | 160m |
t(d)off Max. (s) Off time: | 50n |
I(DM) Max. (A) Pulsed I(D): | 2.5 |
V(GS)th (V) (Min): | 1.0 |
@I(D) (A) (Test Condition): | 250u |
g(fs) Max; (S) Trans. conduct;: | 3.7Â |
@V(DS) (V) (Test Condition): | 16 |
t(r) Max. (s) Rise time: | 20n |
@V(DS) (V) (Test Condition): | 15 |
t(f) Max. (s) Fall time.: | 50n |
IDM Max (@25øC Amb): | 10 |
@V(GS) (V) (Test Condition): | 20 |
I(GSS) Max. (A): | 100n |
Thermal Resistance Junc-Amb.: | 62.5 |
Absolute Max. Power Diss. (W): | 2.0 |
V(BR)GSS (V): | 20 |
V(BR)DSS (V): | 20 |
@V(GS) (V) (Test Condition): | 6 |
td(on) Max (s) On time delay: | 15n |
Maximum Operating Temp (øC): | 150 |
Minimum Operating Temp (øC): | -55 |